ASIC DRAM PHY designer (Tijuana)

As a leading technology innovator, we push the boundaries of what's possible and drive transformation in communication and data processing to help create a smarter, connected future for all. In this journey, we are evolving into an “AI-first” intelligent-edge powerhouse, combining high-performance, low-power compute and seamless connectivity while pushing intelligence closer to users through ultra-efficient, on-device AI that ensures privacy, personalization, and real-time responsiveness. This is the Invention Age—and this is where you come in. Job Overview and Responsibility: We are seeking a highly skilled engineer to develop 2.5D/3D chiplet and networking solution-based technology systems co-optimized for a unique era of heterogeneous compute as Moore’s law slows down. He/she should be able to apply that knowledge to define the company's next generation SoC and platform architectures including partitions for logic and memories and involving 2.5D/3D chiplets and networking technologies to connect them. Candidate will also drive innovation in the group to effectively map emerging AI and other compute use cases to process and chip-integration solutions with detailed knowledge of process technology, 2.5D/3D chiplet architecture, networking technologies, and trade-offs. Knowledge of different IPs e.g., CPU, GPU, NPU and how they act together to drive an E2E use case is a plus. Candidate will work with internal architecture and system teams to develop 2.5D/3D partitions and map to 3D stacking topologies. Candidate will perform system KPI analysis to drive 3D architecture and stacking strategies for new product introduction. Minimum Qualifications:
- Excellent understanding of generic and AI use case KPI dependency on process and system architecture involving chiplets and networking technologies.
- Good knowledge of heterogeneous architecture, 2.5D/3D integration schemes.
- Basic programming skills e.g., ability to model in Python or other languages system use case impact of 3D architectures and integration schemes.
- Master's in Electrical Engineering, Computer Science, or a related field. Additional Qualifications:
- Ability to work without much supervision and as part of a team.
- Most tasks do not have defined steps; simultaneous use of multiple mental abilities is generally required to determine the best approach.
- Advanced data analysis and interpretation skills are required. Minimum Qualifications:
- Bachelor's degree in Science, Engineering, or related field and 5+ years of AI relevant System and technology or related work experience.
- OR Master's degree in Science, Engineering, or related field and 4+ years of AI relevant System and technology or related work experience.
- OR PhD in Science, Engineering, or related field and 3+ years of AI relevant System and technology or related work experience. Job Type: Full-time Pay: $1,000.00
- $1,001.00 per day Work Location: In person Postúlate en Kit Empleo: kitempleo.com.mx/empleo/5vcvp6